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 80 x 80 BGA IC chips reballing repair solder station Chipset US $49.99 
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 BGA Kit Reballing Station JIG + 33pcs 90x90mm NV Stencils + Flux + Solder Ball US $170.09
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 0.20mm 0.20 250K Leaded Solder balls ball BGA reballing SGS US $16.14
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 25K 0.76mm BGA Solder Balls Rework Pb Leaded SN63/PB37 US $8.99
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 0.55mm 250K pcs BGA reballing rework lead solder balls US $20.89
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 0.5 0.6 0.76 mm 0.5mm 0.6mm 0.76mm BGA Solder Balls US $9.90
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 25K 0.60mm BGA Solder Balls Rework Pb Leaded SN63/PB37 US $6.99
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 0.60mm 0.60 250K Leaded Solder balls ball BGA reballing SGS US $24.69
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 0.65mm 0.65 250K Leaded Solder balls ball BGA reballing SGS US $31.34
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Bga Solder
Fix Ylod PS3 Guide
If you are solitary of the unlucky sods with a PS3 pain the infamous YLOD syndrome, you might control heard of the Gilksy reflow mess. You might even control tried it, and really brought your PS3 back from the inert, but odds are it's living on rented period. Read on to ascertain why.
Taking part in an earlier pillar, I described the infamous YLOD syndrome of the PS3. To repeat: Sony uses lead-free solder balls as for each the RoHS directive. Lead-free solder has top melting place, but is more touchy to thermal stresses. The RSX and the CBE chips generate a luck of boil, especially in their 90nm incarnations. The PS3 cooling solution leaves something to be desired. The PCB will warp due to the boil and can cause the solderballs of the BGAs to lose connection. This manifests as the Yellow Light of Death.
Now, the Gilksy conductor advices to employment a heatgun to "reflow" the BGAs. This might sound lovely in theory and it might even piece in practice, next to slightest in support of a while. But you might be aware with the purpose of this kind of mess is acknowledged to be temporary, and it's quite likely with the purpose of the YLOD will promote to a repetition in not too long. How get nearer?
The heartbreaking answer is with the purpose of the Gilksy conductor the majority likely not at all really achieves a proper reflow. What's even sadder is with the purpose of with apiece "reflow", the catch will befall even more relentless. Why?
It's as in order to boil the solder, not simply the solder itself is heated, but plus the BGA. Taking part in information, the boil has to go across the piece in order to stretch to the solder. On top of with the purpose of, in these kind of guides, the inner boil spreader of the piece is as a rule still mounted, denotation boil has even more resistance. On top of with the purpose of, lead-free solder has top melting points, so in information all with the purpose of might come about for the period of this kind of "reflow" is with the purpose of the PCB warps and perhaps family with the purpose of were dejected get nearer concurrently to some extent. Enough to promote to a connection but very fragile. When the console becomes restful again, and the PCB starts to warp, it is prone to break the family after again.
Here is the really bad part though: Solder with the purpose of is available through a boil cycle will really pull off an even top melting place! This process with the purpose of if the firstly mess didn't appropriately pull off a reflow, the go along with period will be even with a reduction of likely to piece! And the third period much more. And so on. Taking part in information, solder will worsen through apiece cycle until it needs to be replaced. Without flux this is even more relentless!
What's really bad is with the purpose of the top the melting place of the solder, the top the BGA piece itself has to be heated in order in support of the boil to stretch to the solder. These chips will be damaged if the heat becomes too superior! Taking part in information, manufacturers as a rule give a boil profile with the purpose of reflow ovens can be automatic to go along. There is a wisdom in support of this profile...
What can be complete approaching this heartbreaking state of affairs?
Well, the inner heatspreader (IHS) on the RSX is very relaxed to remove. I think it's quite weighty to say with the purpose of a few "reflow" be supposed to NOT be attempted with the IHS still attached to the RSX!
There is really a go along with wisdom in support of this, in addition to the boil resistence: The RAM chips underneath the IHS are epoxied to it, but the RSX go down merely has thermal paste. Applying boil to the IHS, in order to boil the BGA in order to boil the solder, will dry not at home the thermal paste that's attaching the RSX go down to the IHS!
The proper way to mess the YLOD is to really remove the BGA, reball it with fresh solder (preferably leaded) and so therefore reflow it (preferably according to the proper heat curve.) This is far from trivial.
Read more: http://fixylodps3.net
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